Comparison of electromigration induced failure between 3D IC and flip chip solder joints

Conference paper

2012 The Minerals, Metals & Materials Society (TMS) Meeting 2012 The Minerals, Metals & Materials Society (TMS) Meeting

2012

Abstract

electromigration induced failure

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Title: Comparison of electromigration induced failure between 3D IC and flip chip solder joints
Creators - without role: Hao Hsu
Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
Publication Details: 2012 The Minerals, Metals & Materials Society (TMS) Meeting 2012 The Minerals, Metals & Materials Society (TMS) Meeting
Identifiers: 9957773319506774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper