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Comparisons of Performance and Reliability in 4H-SiC Tri-gate and Planar MOSFETs
Conference paper

Comparisons of Performance and Reliability in 4H-SiC Tri-gate and Planar MOSFETs

Jia-Wei Hu, Tsung-Yuan Lu, Kuan-Min Kang, Chih-Fang Huang, Bang-Ren Chen and Tian-Li Wu
WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
2023

Abstract

4H-SiC bias-temperature stress MOSFET reliability tri-gate Energy Engineering and Power Technology Electrical and Electronic Engineering Electronic Optical and Magnetic Materials
In this work, a low-voltage tri-gate MOSFET in 4H-SiC is fabricated and measured to compare its performance with a planar gate MOSFET with the same channel length. The preliminary reliability of the devices is also studied. Experimental results show that the larger effective channel width enhances the current of the tri-gate contributed from the trench sidewall and the higher electron channel mobility on the a-face of 4H-SiC pm the sidewall, even though the gate voltage is limited at a lower value. PBTI, NBTI, and dynamic Ron are also measured and the results show that the reliability of both devices are comparable.

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