Abstract
The synthesis of electroplated Nickel (Ni) and electroless Ni in the under-bump metullargy with Sn-rich solder was discussed. Joints of Sn-58Bi/Au/electroless nickel (EN)/Cu/Al 2 O 3 and Sn-58Bi/Au/electroplated nickel/Cu/Al 2 O 3 were aged at 110°C and 130°C. It was found that electroplated Ni failed to prevent copper (Cu) diffusion toward the Ni/solder interface as compared to EN-based joints. Result shows that electroless nickel, with higher phosphorus content was more effective diffusion barrier during aging.