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Contactless stacked-die testing for pre-bond interposers
Conference paper

Contactless stacked-die testing for pre-bond interposers

Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh and Shih-Chieh Chang
Proceedings - Design Automation Conference, 2593111
2014

Abstract

3D-IC Interposer Testing Thermal Analysis
A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%. Copyright 2014 ACM.

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