Correlation between Elemental Distribution and Impact Resistance for Sn-3.0Ag-0.5Cu Solder Joints with BGA Component and PCB Assembly

Conference paper

C.Y. Yu, J.G. Duh, T.K. Lee, M. Tsai and K.C. Liu

TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition

2011

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Title: Correlation between Elemental Distribution and Impact Resistance for Sn-3.0Ag-0.5Cu Solder Joints with BGA Component and PCB Assembly
Creators - without role: C.Y. Yu
J.G. Duh - 國立清華大學工學院材料科學工程學系
T.K. Lee
M. Tsai
K.C. Liu
Identifiers: 9957776574406774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition