- Title
- Correlation between Microstructure Evolution and Mechanical Strength in Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint
- Creators - without role
- C. F. TsengJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition
- Identifiers
- 9957771236806774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Correlation between Microstructure Evolution and Mechanical Strength in Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint
The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition
2013
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