Cu content and size effects upon the reaction layer detachment in the Sn-Cu/Ni couples

Conference paper

C.-H. Wang and S.-W. Chen

The 135th TMS Annual Meeting(2006) The 135th TMS Annual Meeting(2006)

2006

Abstract

Cu content,size effects,reaction layer detachment,Sn-Cu/Ni couples

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Title: Cu content and size effects upon the reaction layer detachment in the Sn-Cu/Ni couples
Creators - without role: C.-H. Wang
S.-W. Chen - 國立清華大學工學院化學工程學系
Publication Details: The 135th TMS Annual Meeting(2006) The 135th TMS Annual Meeting(2006)
Identifiers: 9957767217706774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper