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Cyber physical system (CPS) for contactless IC testing
Conference paper

Cyber physical system (CPS) for contactless IC testing

Jui-Hung Chien, Nien-Tzu Chang, Chia-Hung Huang, Shih-Chieh Chang and Wei Han Wang
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings, pp.340-343
23/12/2015

Abstract

3D-IC Interposer Testing Thermal Analysis
In this paper, we study the testing flow in fabrication process of stacked-die products. We discuss the difficulties of traditional testing mechanism. To improve production yield, a contactless testing with cyber physical system (CPS) for pre-bond interposers is proposed in this paper. We propose a testing framework comprising a heating laser and an infrared-radiation camera. In addition, we also build a completely correct model of a functional interposer. By our proposed Classification Algorithm and BDA classifier, functional and defective interposers can be differentiated. Our experimental results show that the proposed framework provides an over 97% accuracy to identify functional interposers from a whole batch of untested products.

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