- Title
- Decapsulation Method for Flip Chip with Ceramics in Microelectronic Package
- Creators - without role
- T.I. ShihJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
- Identifiers
- 9957773372506774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Decapsulation Method for Flip Chip with Ceramics in Microelectronic Package
2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
2006
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