Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies

Conference paper

C. C. Lee, C. T. Peng and K. N. Chiang

Taiwan ANSYS Conference Taiwan ANSYS Conference, pp.214-221

2004

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Title: Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
C. T. Peng
K. N. Chiang
Publication Details: Taiwan ANSYS Conference Taiwan ANSYS Conference, pp.214-221
Identifiers: 9957766806006774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper