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Design and Characterization of a CMOS MEMS Capacitive Squeeze-Film Pressure Sensor
Conference paper

Design and Characterization of a CMOS MEMS Capacitive Squeeze-Film Pressure Sensor

Jason Chiu and Michael S.-C. Lu
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2019-January, pp.755-758
01/2019

Abstract

Electronic Optical and Magnetic Materials Condensed Matter Physics Mechanical Engineering Electrical and Electronic Engineering
A capacitive pressure sensor operated based on the elastic squeeze-film damping effect is implemented, for the first time, in a CMOS process to provide sensor integration and sensitivity improvement. Sensor fabrication is simplified as a squeeze-film pressure sensor does not require a sealed membrane as in conventional sensors; in addition, sensitivity is significantly enhanced with the small gap achieved between capacitive plates. The sensor with a resonant plate size of 200 imes 200 mu mathrm{m}^{2} demonstrates a sensitivity of 793 Hz/kPa.

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