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Design and fabrication of a high frequency thin film resonator using low acoustic impedance reflective layer
Conference paper

Design and fabrication of a high frequency thin film resonator using low acoustic impedance reflective layer

Chung-Hsien Lin, Hong-Ren Chen, Chen-Hsun Du and Weileun Fang
American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS), Vol.5, pp.77-82
2003

Abstract

A high frequency thin film resonator using single reflective layer is presented. The reflective layer is chosen to have a low acoustic impedance to reflect acoustic waves, which is generated by the piezoelectric layer above it. With an air interface serves as a free boundary at the other end of piezoelectric layer, a high frequency resonator can be formed. Since the fabrication process included no bulk etching and multi-layer, a high manufacturability can be achieved. Moreover, the novel device and its applications can be designed to be suit many mobile communication applications.

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