- Title
- Development for Equivalent Material Properties of Microbump Utilized in Simulation of Chip Stacking Packaging
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系T. L. TzengP. C. Huang
- Publication Details
- International Multi-Conference on Engineering and Technology Innovation 2015 (IMETI2015) International Multi-Conference on Engineering and Technology Innovation 2015 (IMETI2015)
- Identifiers
- 9957766427306774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Development for Equivalent Material Properties of Microbump Utilized in Simulation of Chip Stacking Packaging
International Multi-Conference on Engineering and Technology Innovation 2015 (IMETI2015) International Multi-Conference on Engineering and Technology Innovation 2015 (IMETI2015)
2015
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