- 題名
- Development of Ag-to-Ag Direct Bonding Technique for Ge-Pb-Te Thermoelectric Materials and Cu Electrodes
- 創作者：
- Y.-E. Tasi (作者)C.-L. Shieh (作者)Chien-Neng Liao - 國立清華大學, 半導體研究學院
- 會議
- TMS 2024 153rd Annual Meeting & Exhibition (Orlando, Florida, USA, 03/03/2024–07/03/2024)
- 學術資源類型
- 會議論文
- 語言
- 英語
會議論文
Development of Ag-to-Ag Direct Bonding Technique for Ge-Pb-Te Thermoelectric Materials and Cu Electrodes
TMS 2024 153rd Annual Meeting & Exhibition (Orlando, Florida, USA, 03/03/2024–07/03/2024)
指標
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