Development of Ag-to-Ag Direct Bonding for Ge-Pb-Te thermoelectric and Cu electrodes with electroless plated M/Ni diffusion barrier

Y.-E. Tasi, C.-L. Shieh Chien-Neng Liao

IMPACT 2023 Conference (Taipei, Taiwan, 25/10/2023–27/10/2023)

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: Development of Ag-to-Ag Direct Bonding for Ge-Pb-Te thermoelectric and Cu electrodes with electroless plated M/Ni diffusion barrier
: Y.-E. Tasi (Author)
C.-L. Shieh (Author)
Chien-Neng Liao - National Tsing Hua University, College of Semiconductor Research
: IMPACT 2023 Conference (Taipei, Taiwan, 25/10/2023–27/10/2023)
: Conference paper