Abstract
The various platforms developed for the fabrication of microelectromechanical systems (MEMS) are discussed. The MOBSE platform integrates DRIE etching, tench-refilled molding, MUMPs and bulk releasing, to improve the variety and performance of MEMS devices. The BLEST platform, which employs the DRIE, heavily boron diffusion and anisotropic bulk Si etching, is expected to contribute in making HARM devices more competitive and convenient. The DAWN platform applies several difficult silicon etching to directly fabricate MEMS components using the single crystal silicon.