- Title
- Diffusion Path and Interdiffusion Structure in the Flip-Chip Eutectic Sn-Pb Solder Bump with Ni/Cu UBM during Reflow and after Aging
- Creators - without role
- G.Y. JangL.Y. HsiaoS.Y. TsaiJ.G. Duh - 國立清華大學工學院材料科學工程學系Mysore A. Dayananda
- Publication Details
- 2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
- Identifiers
- 9957776735906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Diffusion Path and Interdiffusion Structure in the Flip-Chip Eutectic Sn-Pb Solder Bump with Ni/Cu UBM during Reflow and after Aging
2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
2006
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