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Diffusive crack growth at a bimaterial interface
Conference paper

Diffusive crack growth at a bimaterial interface

Tze-jer Chuang, June-Liang Chu and Sanboh Lee
American Society of Mechanical Engineers (Paper)
1996

Abstract

The service life of advanced ceramic composites under creep-rupture conditions was estimated by investigating the high temperature microcrackgrowth behavior along a planar interface between two elastic dissimilar media. The crack was assumed to grow along the interface normal to a remotely applied tensile stress via a coupled surface and grain boundary diffusion under steady creep conditions. The governing integro-differential equation containing the unknown tensile distribution was derived and it was found that a new length parameter exists as a scaling factor for the interface for which the solution becomes identical to the single phase media when plotted on the nondimensional physical plane.

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