Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization

C.H. Shih; H.W. Su; C.J. Lin; T. Ko; C.H. Chen; J.J. Huang; S.W. Chou; C.H. Peng; C.H. Hsieh; M.H. Tsai; Winston S. Shue; C.H. Yu; M.S. Liang

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Conference paper

Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization

C.H. Shih, H.W. Su, C.J. Lin, T. Ko, C.H. Chen, J.J. Huang, S.W. Chou, C.H. Peng, C.H. Hsieh, M.H. Tsai, …

Technical Digest - International Electron Devices Meeting, IEDM, pp.337-340

2004

Appears in keyword about Physics

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Electronic

Optical and Magnetic Materials

Condensed Matter Physics

Electrical and Electronic Engineering

Materials Chemistry

Direct electro-deposition of a highly conformal and adherent Cu seed on ALD TaN by means of electro-grafting technique is presented. Both the adhesion of Cu seed to the underlying ALD TaN and EM lifetime performance were greatly enhanced by electro-grafting process, while the benefit of low via and line resistance of ALD TaN were maintained. This direct plated Cu seed layer on ALD TaN was demonstrated to successfully extend the current ECP to 45nm-node metallization and beyond. © 2004 IEEE.

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Title: Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization
Translated title: Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization
Creators - without role: C.H. Shih - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
H.W. Su - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
C.J. Lin - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
T. Ko - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
C.H. Chen - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
J.J. Huang - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
S.W. Chou - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
C.H. Peng - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
C.H. Hsieh - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
M.H. Tsai - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
Winston S. Shue - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
C.H. Yu - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
M.S. Liang - Taiwan Semiconductor Manufacturing Company , Science-Based Industrial Park
Publication Details: Technical Digest - International Electron Devices Meeting, IEDM, pp.337-340
Identifiers: 9957777135206774
Academic Unit: Institute of Electronics Engineering, College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Conference paper

Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization

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