Drop Response and Evaluation for Multi-level Assembly Joints with Slightly Significant Pd or Ni(P) Layer Deposit Under Thermal Aging

Conference paper

H.M. Lin, C.Y. Ho, W.L. Chen, Y.H. Wu, D.H. Wang, J.R. Lin, Y.H. Wu, H.C. Hong, Z.W.Lin and J.G. Duh

TMS 2014 143rd ANNUAL MEETING & EXHIBITION TMS 2014 143rd ANNUAL MEETING & EXHIBITION

2014

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Title: Drop Response and Evaluation for Multi-level Assembly Joints with Slightly Significant Pd or Ni(P) Layer Deposit Under Thermal Aging
Creators - without role: H.M. Lin
C.Y. Ho
W.L. Chen
Y.H. Wu
D.H. Wang
J.R. Lin
Y.H. Wu
H.C. Hong
Z.W.Lin
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: TMS 2014 143rd ANNUAL MEETING & EXHIBITION TMS 2014 143rd ANNUAL MEETING & EXHIBITION
Identifiers: 9957767430306774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper