EUV pellicle technology for high volume wafer production

Conference paper

Yun-Yao Lin, Pei-Hsun Tsai, Kelvin Elphick, Ching-Ho Hsu, Dino K. L. Shieh, Feng Hao Chang, 健朝黃, Jerry C. Y. Chen and Vincent C. W. Wen

Proceedings of the SPIE, Vol.12750

11/2023

Abstract

EUV lithography;semiconductor industry;pellicle;high volume wafer production

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Title: EUV pellicle technology for high volume wafer production
Creators - without role: Yun-Yao Lin - Taiwan Semiconductor Manufacturing Company (Taiwan)
Pei-Hsun Tsai - Taiwan Semiconductor Manufacturing Company (Taiwan)
Kelvin Elphick - Taiwan Semiconductor Manufacturing Company (Taiwan)
Ching-Ho Hsu - Taiwan Semiconductor Manufacturing Company (Taiwan)
Dino K. L. Shieh
Feng Hao Chang - Taiwan Semiconductor Manufacturing Company (Taiwan)
健朝黃
Jerry C. Y. Chen - Taiwan Semiconductor Manufacturing Company (Taiwan)
Vincent C. W. Wen
Publication Details: Proceedings of the SPIE, Vol.12750
Identifiers: 9957776202906774
Academic Unit: College of Semiconductor Research, National Tsing Hua University
Language: English
Resource Type: Conference paper