- Title
- Effect of Cu addition in Sn solder on the interfacial reaction with element Te substrate
- Creators - without role
- G. H. LeeC. N. Liao - 國立清華大學工學院材料科學工程學系
- Publication Details
- TMS 138th Annual Meeting & Exhibition
- Identifiers
- 9957768875306774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Effect of Cu addition in Sn solder on the interfacial reaction with element Te substrate
TMS 138th Annual Meeting & Exhibition
2009
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