Effect of Entropy Production on Microstructure Change in Flip Chip Solder Joints by Joule Heating in Electromigration

Conference paper

Fan-Yi Ouyang, Hao Hsu, K. N. Tu and Yi-Shao Lai

IUMRS-ICA 2011 12th International Conference in Asia IUMRS-ICA 2011 12th International Conference in Asia

2011

Abstract

Microstructure Change

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Title: Effect of Entropy Production on Microstructure Change in Flip Chip Solder Joints by Joule Heating in Electromigration
Creators - without role: Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
Hao Hsu
K. N. Tu
Yi-Shao Lai
Identifiers: 9957774276206774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: IUMRS-ICA 2011 12th International Conference in Asia IUMRS-ICA 2011 12th International Conference in Asia