- Title
- Effect of NH3/He Plasma Treatment on Electromigration Behavior and Electrical Reliability of Cu Interconnects
- Creators - without role
- Shou-Yi Chang - 國立清華大學工學院材料科學工程學系Fong-Jie LinChia-Feng Lin
- Publication Details
- Proceedings of the Symposium “E5—Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 10” of the 215th ECS Meeting Proceedings of the Symposium “E5—Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 10” of the 215th ECS Meeting, Vol.19(2), pp.785-794
- Identifiers
- 9957773538406774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Effect of NH3/He Plasma Treatment on Electromigration Behavior and Electrical Reliability of Cu Interconnects
Proceedings of the Symposium “E5—Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 10” of the 215th ECS Meeting Proceedings of the Symposium “E5—Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 10” of the 215th ECS Meeting, Vol.19(2), pp.785-794
2009
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