Effect of Nano-Sized Cu6Sn5 Doping on Microstructure and Strength for the Sn-Ag-Cu Solder Joint with Au/Ni-P/Al UBM

Conference paper

G.J. Chiou and J.G. Duh

2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition

2006

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Title: Effect of Nano-Sized Cu6Sn5 Doping on Microstructure and Strength for the Sn-Ag-Cu Solder Joint with Au/Ni-P/Al UBM
Creators - without role: G.J. Chiou
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: 2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
Identifiers: 9957776382706774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper