- Title
- Effect of joint thickness on void formation and intermetallic compound dissolution for Pb-free solders during electromigration
- Creators - without role
- Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
- Identifiers
- 9957776215906774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Effect of joint thickness on void formation and intermetallic compound dissolution for Pb-free solders during electromigration
2015
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