Effect of solder bump heights on Cu dissolution rate in Pb-free Flip chip solder joints by electromigration

Conference paper

Fan-Yi Ouyang, Pilin Liu, Matt Pharr, Kejie Zhao and Zhigang Suo

2011 The Minerals, Metals & Materials Society (TMS) Meeting 2011 The Minerals, Metals & Materials Society (TMS) Meeting

2011

Abstract

Cu dissolution rate

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Title: Effect of solder bump heights on Cu dissolution rate in Pb-free Flip chip solder joints by electromigration
Creators - without role: Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
Pilin Liu
Matt Pharr
Kejie Zhao
Zhigang Suo
Publication Details: 2011 The Minerals, Metals & Materials Society (TMS) Meeting 2011 The Minerals, Metals & Materials Society (TMS) Meeting
Identifiers: 9957773252106774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper