Effect of soldering reaction on he electrical properties of bismuth telluride/Cu junctions

Conference paper

C. N. Liao, W. J. Chen and J. H. Li

TMS 136th Annual Meeting & Exhibition

2007

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Title: Effect of soldering reaction on he electrical properties of bismuth telluride/Cu junctions
Creators - without role: C. N. Liao - 國立清華大學工學院材料科學工程學系
W. J. Chen
J. H. Li
Identifiers: 9957776171106774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: TMS 136th Annual Meeting & Exhibition