Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions

Conference paper

C. N. Liao, C. H. Lee and W. J. Chen

26th International Conference on Thermoelectrics

2007

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Title: Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions
Creators - without role: C. N. Liao - 國立清華大學工學院材料科學工程學系
C. H. Lee
W. J. Chen
Publication Details: 26th International Conference on Thermoelectrics
Identifiers: 9957767521906774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper