- Title
- Effect of temperature and substrate on microstructure and preferred orientation of copper films prepared by pulsed electrodeposition
- Creators - without role
- L. C. TsengC. N. Liao - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957775666906774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- E-MRS 2012 Spring Meeting
Conference paper
Effect of temperature and substrate on microstructure and preferred orientation of copper films prepared by pulsed electrodeposition
E-MRS 2012 Spring Meeting
2012
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