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Effect of temperature gradient on the growth of Ag3Sn intermetallic compounds in Pb0free solder during thermos-compressive bonding process
Conference paper

Effect of temperature gradient on the growth of Ag3Sn intermetallic compounds in Pb0free solder during thermos-compressive bonding process

Hsin-Yuan Chen, Yu-ping Su and Fan-Yi Ouyang
2015

Abstract

thermos-compressive bonding process

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