Abstract
Nano-twined Cu thin films were successfully deposited on Si (100) substrate by using unbalanced magnetron sputtering (UBMS) system. The objective of this study was to investigate the effect of temperature on the structures and corrosive behavior of Cu thin films. Transmission Electron Microscopy (TEM) was used to examine microstructure and preferred orientation of the nano twin. The residual stresses of all Cu films were also measured. The results show that (111) was the dominant preferred orientation in the Cu films. The change of the temperature would strongly vary the hardness, nano-twin spacing, and grain size. The results also suggested that nano-twin structure tended to form at lower temperature with high deposition rate although the temperature would rise to 60℃ because of the plasma. To investigate the corrosion of Cu during chemical mechanical polishing process, corrosive behavior of nano-twin Cu would also be discussed and compared.