Effect of the Cu Thickness in Ti/Ni(V)/Cu UBM on Interfacial Reaction and Mechanical Test of Sn3.0Ag0.5Cu Solder Joint

Conference paper

K.J. Wang, C.Y. Yu and J.G. Duh

TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition

2011

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Title: Effect of the Cu Thickness in Ti/Ni(V)/Cu UBM on Interfacial Reaction and Mechanical Test of Sn3.0Ag0.5Cu Solder Joint
Creators - without role: K.J. Wang
C.Y. Yu
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition
Identifiers: 9957774267806774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper