Effective Material Characteristics Extraction on Redistribution Layer of Fan-Out Panel-Level Packaging Architecture

Conference paper

The 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2020)

10/2020

Abstract

Fan-Out Panel-Level Packaging Architecture

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Title: Effective Material Characteristics Extraction on Redistribution Layer of Fan-Out Panel-Level Packaging Architecture
Creators - without role: 昌駿李
Identifiers: 9957776993706774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: The 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2020)