- Title
- Effects of Cu seed-layer on Ti/CoCrPt perpendicular media
- Creators - without role
- T. M. TaiC. H. Lai - 國立清華大學工學院材料科學工程學系R. F. JiangC. M. ChienT. S. ChinR. T. HuangF. R. ChenJ. J. Kai
- Identifiers
- 9957775974306774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Effects of Cu seed-layer on Ti/CoCrPt perpendicular media
2004
Metrics
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