Effects of Ni Particles and Nano-sized Ni3Sn4 Powders Addition on the Interfacial Reactions between Sn-Ag-Ni Solders and Cu Substrate

Conference paper

H.Y. Lee, L.Y. Hsiao, J.G. Duh, S.Y. Tsai and C.R. Lee

2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition

2006

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Title: Effects of Ni Particles and Nano-sized Ni3Sn4 Powders Addition on the Interfacial Reactions between Sn-Ag-Ni Solders and Cu Substrate
Creators - without role: H.Y. Lee
L.Y. Hsiao
J.G. Duh - 國立清華大學工學院材料科學工程學系
S.Y. Tsai
C.R. Lee
Publication Details: 2006 135th TMS Annual Meeting & Exhibition 2006 135th TMS Annual Meeting & Exhibition
Identifiers: 9957776900806774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper