- Title
- Effects of Ni-based Substrates and Cu-based Substrates on Grain Structure of Beta-tin in Pb-free Solder Joints
- Creators - without role
- T.T. ChouW.Y. ChenC.Y. HoH.M. LinJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- European Materials Research Society 2014 Fall Meeting European Materials Research Society 2014 Fall Meeting
- Identifiers
- 9957770739006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Effects of Ni-based Substrates and Cu-based Substrates on Grain Structure of Beta-tin in Pb-free Solder Joints
European Materials Research Society 2014 Fall Meeting European Materials Research Society 2014 Fall Meeting
2014
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