Electric current effects in the flip chip solder joints

Conference paper

C.-H. Wang and S.-W. Chen

IMAPS-Taiwan 2005 international technical symposium proceeding and CD IMAPS-Taiwan 2005 international technical symposium proceeding and CD

2005

Abstract

Electric current effects;flip chip solder joints

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Title: Electric current effects in the flip chip solder joints
Creators - without role: C.-H. Wang
S.-W. Chen - 國立清華大學工學院化學工程學系
Publication Details: IMAPS-Taiwan 2005 international technical symposium proceeding and CD IMAPS-Taiwan 2005 international technical symposium proceeding and CD
Identifiers: 9957771987006774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper