- Title
- Electromigration (EM) of Solder Joint in Electronic Packaging
- Creators - without role
- Pilin LiuFan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系Emily OuJung-Kyu HanGerry LeathermanZezhong FuJun HeGoyal Deepak
- Publication Details
- 2008 ASME international mechanical engineering congress and exposition conference 2008 ASME international mechanical engineering congress and exposition conference
- Identifiers
- 9957769259806774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Electromigration (EM) of Solder Joint in Electronic Packaging
2008 ASME international mechanical engineering congress and exposition conference 2008 ASME international mechanical engineering congress and exposition conference
2008
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