- Title
- Electromigration Effect of Flexible Fan-out Packages
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系C. P. HsiehC. W. WangW. Y. ChengJ. C. Chuang
- Publication Details
- 2018 International Microsystems Packaging Assembly and Circuits Technology Conference (the 13th IMPACT Conference) 2018 International Microsystems Packaging Assembly and Circuits Technology Conference (the 13th IMPACT Conference)
- Identifiers
- 9957769161606774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Electromigration Effect of Flexible Fan-out Packages
2018 International Microsystems Packaging Assembly and Circuits Technology Conference (the 13th IMPACT Conference) 2018 International Microsystems Packaging Assembly and Circuits Technology Conference (the 13th IMPACT Conference)
2018
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