- Title
- Electromigration effects upon interfacial reactions in teh Pb-free solder joints
- Creators - without role
- S.-W. Chen - 國立清華大學工學院化學工程學系S.-K. LinC.-N. ChiuY.-C. Huang
- Identifiers
- 9957776744006774
- Academic Unit
- Department of Chemical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 2006 International Conference on Chemical and Molecular Technologies(Invited lecture) 2006 International Conference on Chemical and Molecular Technologies
Conference paper
Electromigration effects upon interfacial reactions in teh Pb-free solder joints
2006 International Conference on Chemical and Molecular Technologies(Invited lecture) 2006 International Conference on Chemical and Molecular Technologies
2006
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