Electromigration effects upon the lead-free solder joints

Conference paper

S.-W. Chen, S.-H. Wu, C.-M. Chen and C.-H. Wang

The 2002 Taiwan/Korea/Japan Chemical Engineering Conference The 2002 Taiwan/Korea/Japan Chemical Engineering Conference

2002

Abstract

Electromigration effects;lead-free solder joints

1 Record Views

Title: Electromigration effects upon the lead-free solder joints
Creators - without role: S.-W. Chen - 國立清華大學工學院化學工程學系
S.-H. Wu
C.-M. Chen
C.-H. Wang
Publication Details: The 2002 Taiwan/Korea/Japan Chemical Engineering Conference The 2002 Taiwan/Korea/Japan Chemical Engineering Conference
Identifiers: 9957777746806774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper