Electromigration studies at surfaces and grain boundaries using in-situ TEM

Conference paper

K. C. Chen, W. W. Wu, H. P. Chen, C. N. Liao, L. J. Chen and K. N. Tu

11th International Workshop on Stress-Induced Phenomenon in Metallization

2010

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Title: Electromigration studies at surfaces and grain boundaries using in-situ TEM
Creators - without role: K. C. Chen
W. W. Wu
H. P. Chen
C. N. Liao - 國立清華大學工學院材料科學工程學系
L. J. Chen
K. N. Tu
Publication Details: 11th International Workshop on Stress-Induced Phenomenon in Metallization
Identifiers: 9957770270906774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper