Electron Microscopy Evaluation of Interfacial Reaction in Lead-Free Solder and Sn-Pb Solder with Ni/Cu Under-Bump Metallization

Conference paper

L.Y. Hsiao and J.G. Duh

International Conference on Metallurgical Coating and Thin Films International Conference on Metallurgical Coating and Thin Films

2005

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Title: Electron Microscopy Evaluation of Interfacial Reaction in Lead-Free Solder and Sn-Pb Solder with Ni/Cu Under-Bump Metallization
Creators - without role: L.Y. Hsiao
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: International Conference on Metallurgical Coating and Thin Films International Conference on Metallurgical Coating and Thin Films
Identifiers: 9957768158306774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper