- Title
- Electroplating of Copper with Microstructure Control and The Applications to Energy Storage Systems
- Creators - without role
- 啟章 胡
- Identifiers
- 9957771358506774
- Academic Unit
- Department of Chemical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
Electroplating of Copper with Microstructure Control and The Applications to Energy Storage Systems
2021
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