Electrothermal coupling analysis for electromigration mechanism of flip chip packages

Conference paper

Peer reviewed

Chin-Li Kao, Fan-Yi Ouyang, Yi-Shao Lai and Chang-Lin Yeh

2007 Taiwan ANSYS User conference

2007

Abstract

electromigration mechanism

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Title: Electrothermal coupling analysis for electromigration mechanism of flip chip packages
Creators - without role: Chin-Li Kao
Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
Yi-Shao Lai
Chang-Lin Yeh
Identifiers: 9957777590406774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 2007 Taiwan ANSYS User conference