- Title
- Elemental diffusion behavior for the Sn-37Pb and Sn-3.0Ag-0.5Cu joints with Cu and Ni Substrates during Aging
- Creators - without role
- K.J. WangP.J. HuangJ.G. Duh - 國立清華大學工學院材料科學工程學系M.A. Dayananda
- Publication Details
- TMS 2007 136 th Annual Meeting & Exhibition TMS 2007 136 th Annual Meeting & Exhibition
- Identifiers
- 9957768834606774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Elemental diffusion behavior for the Sn-37Pb and Sn-3.0Ag-0.5Cu joints with Cu and Ni Substrates during Aging
TMS 2007 136 th Annual Meeting & Exhibition TMS 2007 136 th Annual Meeting & Exhibition
2007
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