Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment

T.C. Chang; P.T. Liu; Y.S. Mor; T.M. Tsai; C.W. Chen; Y.J. Mei; F.M. Pan; W.F. Wu; S.M. Sze

doi:10.1116/1.1495876

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Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment

Conference paper

Peer reviewed

Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment

T.C. Chang, P.T. Liu, Y.S. Mor, T.M. Tsai, C.W. Chen, Y.J. Mei, F.M. Pan, W.F. Wu and S.M. Sze

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol.20(4), pp.1561-1566

07/2002

DOI: https://doi.org/10.1116/1.1495876

Appears in keyword about Physics

Abstract

Condensed Matter Physics

Electrical and Electronic Engineering

O ₂ plasma ashing and wet stripper treatment were shown to lead to the dielectric degradation in OSG film during photoresist removal processing. The dielectric degradation results from the moisture uptake. It was confirmed that TMCS treatment is an effective method to negate the dielectric degradation in the OSG film for the photoresist removal application.

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Title: Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
Translated title: Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
Creators - without role: T.C. Chang - National Sun Yat-sen University
P.T. Liu - National Institutes of Applied Research
Y.S. Mor - National Yang Ming Chiao Tung University
T.M. Tsai - National Yang Ming Chiao Tung University
C.W. Chen - National Yang Ming Chiao Tung University
Y.J. Mei - Ching Kuo Institute of Management and Health
F.M. Pan - National Institutes of Applied Research
W.F. Wu - National Institutes of Applied Research
S.M. Sze - National Yang Ming Chiao Tung University
Identifiers: 9957773100406774
Academic Unit: Department of Engineering and System Science, College of Nuclear Science, National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol.20(4), pp.1561-1566

Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment

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