Abstract
From the experimental measurements, the dominant charge source for a packaged IC chip during a charged-device model (CDM) ESD event is the capacitor between the die-attach plate and the metal bus line, CSUB. By adding a bonding wire between the die-attach plate and the Vss pin, a parallel inductor to the CSUB can be created. The CDM-robustness for the packaged IC chip is significantly improved because of this parallel LC resonance circuit. © 2015 IEEE.