Enhancement of electromigration resistance in twin-structured copper investigated by in situ transmission electron microscopy

Conference paper

C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen

2008 MRS Spring Meeting

2008

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Title: Enhancement of electromigration resistance in twin-structured copper investigated by in situ transmission electron microscopy
Creators - without role: C. N. Liao - 國立清華大學工學院材料科學工程學系
K. C. Chen
W. W. Wu
L. J. Chen
Publication Details: 2008 MRS Spring Meeting
Identifiers: 9957767050206774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper